Our 64-layer PCB fabrication service delivers the highest level of circuit density and complexity available in modern electronics manufacturing. Engineered for cutting-edge applications where space constraints and performance demands push the boundaries of traditional PCB technology.

Key Features

Maximum Layer Count: 64 conductive layers with precision-controlled impedance and minimal signal loss, enabling unprecedented circuit density in compact form factors.

Advanced Materials: Utilizing low-loss dielectric materials and high-performance copper foils optimized for high-frequency applications and thermal management.

Micro-Via Technology: Sequential build-up process with micro-vias as small as 0.1mm diameter, enabling dense interconnections between layers while maintaining signal integrity.

Precision Manufacturing: Tolerances held to ±0.05mm with advanced drilling and plating processes ensuring reliable via connections across all 64 layers.

Controlled Impedance: Precisely matched impedance characteristics across all signal layers, critical for high-speed digital and RF applications.

Technical Specifications

• Layer Count: Up to 64 layers
• Minimum Trace Width: 0.075mm (3 mil)
• Minimum Via Size: 0.1mm diameter
• Board Thickness: 2.5-6.0mm depending on layer stackup
• Dielectric Materials: FR-4, polyimide, and low-loss specialized substrates
• Copper Weight: 0.5-2.0 oz per layer
• Surface Finish: HASL, ENIG, OSP, or immersion silver options

Applications

Ideal for aerospace and defense systems, high-performance computing, telecommunications infrastructure, medical devices, and advanced automotive electronics where maximum functionality must be achieved in minimal space.

Quality Assurance

Every 64-layer PCB undergoes comprehensive electrical testing, impedance verification, and thermal cycling validation to ensure reliability in demanding applications. Full traceability and documentation provided for critical applications.

Lead Time: 15-20 business days depending on complexity and quantity.

Transform your most challenging circuit designs into reality with our 64-layer PCB fabrication capabilities – where engineering excellence meets manufacturing precision.

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Our 40-layer PCB production service delivers exceptional ultra-high layer count printed circuit boards designed for the most demanding electronic applications. These sophisticated multilayer boards provide unparalleled signal integrity, power distribution, and component density for cutting-edge technology projects.

Key Features

Ultra-High Layer Count: Precisely manufactured 40-layer construction enables complex routing architectures and advanced signal management for high-performance electronic systems.

Superior Signal Integrity: Multiple dedicated signal layers with controlled impedance characteristics ensure optimal performance for high-speed digital circuits, RF applications, and sensitive analog designs.

Advanced Power Distribution: Integrated power and ground planes throughout the layer stack provide stable power delivery with minimal noise and improved electromagnetic compatibility.

Precision Manufacturing: State-of-the-art fabrication processes maintain tight tolerances and consistent layer registration across all 40 layers, ensuring reliable interconnections and optimal electrical performance.

High-Density Interconnect: Supports fine-pitch components, microvias, and complex routing patterns essential for miniaturized electronic devices and space-constrained applications.

Applications

Ideal for aerospace electronics, telecommunications infrastructure, medical devices, automotive control systems, industrial automation, and high-performance computing applications where maximum circuit density and reliability are critical.

Technical Specifications

• Layer Count: 40 layers
• Board Thickness: Custom thickness based on application requirements
• Minimum Trace Width: Down to 3 mil (0.075mm)
• Via Technology: Through-hole, blind, and buried vias supported
• Material Options: FR-4, high-frequency laminates, and specialty substrates
• Surface Finishes: HASL, ENIG, OSP, and immersion silver available

Lead Time: 3-4 weeks depending on complexity and quantity

Perfect for engineers and manufacturers requiring the ultimate in PCB complexity and performance for next-generation electronic systems.

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Key Features:

• 32 conductive layers with precise impedance control and minimal signal loss
• Advanced HDI (High Density Interconnect) technology with microvias and blind/buried vias
• Superior signal integrity through optimized layer stackup and controlled dielectric properties
• Exceptional thermal management with integrated heat dissipation solutions
• Ultra-fine pitch capability supporting component densities up to 0.4mm BGA and beyond
• Multilayer shielding for EMI/EMC compliance and crosstalk elimination

Technical Specifications:

• Layer count: 32 layers maximum
• Minimum trace width: 0.075mm (3 mil)
• Minimum via size: 0.1mm (4 mil)
• Board thickness: 1.6mm – 6.0mm
• Copper weight: 0.5oz – 2oz per layer
• Dielectric materials: FR-4, Rogers, Polyimide, and specialized low-loss materials
• Surface finish: HASL, ENIG, OSP, Immersion Silver, Hard Gold

Applications:

• High-speed digital processors and GPUs
• RF/microwave communication systems
• Aerospace and defense electronics
• Medical imaging equipment
• 5G infrastructure and base stations
• High-performance computing servers
• Automotive ADAS and autonomous driving systems

Quality Assurance:

• IPC Class 2 and Class 3 compliance
• 100% electrical testing and impedance verification
• Advanced AOI (Automated Optical Inspection)
• Cross-sectional analysis and microsectioning
• Comprehensive design rule checking (DRC)

Manufacturing Capabilities:

• Lead time: 15-25 business days
• Minimum order quantity: 5 pieces
• Maximum panel size: 18″ x 24″
• Advanced sequential lamination process
• Precision drill registration and layer alignment

Our experienced engineering team provides comprehensive design support, including stackup optimization, signal integrity analysis, and thermal modeling to ensure your 32-layer PCB meets the most stringent performance requirements while maintaining manufacturing reliability and cost-effectiveness.

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Product Overview

Our 24-layer PCB fabrication represents the pinnacle of multilayer circuit board technology, engineered for complex, high-performance electronic systems that require exceptional signal integrity and component density. This maximum layer count solution enables designers to create sophisticated circuits with optimal power distribution, signal routing, and electromagnetic compatibility.

Key Features

Maximum Layer Density: With 24 conductive layers, achieve unparalleled circuit complexity and routing flexibility for advanced electronic designs.

Superior Signal Integrity: Advanced layer stackup configurations minimize crosstalk and electromagnetic interference, ensuring clean signal transmission across all layers.

Precision Manufacturing: State-of-the-art fabrication processes with tight tolerances deliver consistent quality and reliability across every layer.

Flexible Design Options: Support for various via types including blind, buried, and micro vias to optimize layer transitions and space utilization.

High-Performance Materials: Premium substrate materials with excellent thermal and electrical properties to handle demanding operational conditions.

Technical Specifications

• Layer Count: 24 layers maximum
• Board Thickness: Customizable from 1.6mm to 6.4mm
• Minimum Trace Width: Down to 0.075mm (3 mil)
• Via Options: Through-hole, blind, buried, and micro vias
• Copper Weight: 0.5oz to 3oz per layer
• Solder Mask: Green, blue, red, black, white, yellow options
• Surface Finish: HASL, ENIG, OSP, immersion tin/silver

Applications

Perfect for aerospace systems, telecommunications equipment, medical devices, high-speed computing, server motherboards, and any application requiring maximum circuit density with superior electrical performance.

Quality Assurance

Every 24-layer PCB undergoes rigorous testing including electrical continuity checks, impedance control verification, and automated optical inspection to ensure flawless performance in your critical applications.

Ready to maximize your design potential? Contact our engineering team to discuss your 24-layer PCB requirements and receive a customized quote.

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Our 20-layer PCB production service delivers exceptional performance for the most demanding electronic applications. These ultra-complex circuits provide unparalleled signal integrity, power distribution, and component density for cutting-edge technology projects.

Key Features

Advanced Layer Stack-Up

• 20 conductive copper layers with optimized impedance control
• Precision dielectric spacing for superior signal transmission
• Controlled impedance matching (±10% tolerance)
• Multi-power plane distribution for clean power delivery

Superior Technical Specifications

• Board thickness: 2.0-3.2mm standard (custom thickness available)
• Minimum trace width: 0.075mm (3 mil)
• Minimum via size: 0.15mm (6 mil)
• Copper weight: 1-4 oz per layer
• Surface finish: HASL, ENIG, or OSP options

Quality Manufacturing Process

• State-of-the-art HDI (High Density Interconnect) technology
• Automated optical inspection (AOI) at every stage
• X-ray inspection for internal layer verification
• IPC Class 2 and Class 3 compliance
• Full electrical testing and continuity verification

Applications

Perfect for high-performance applications including:

• Enterprise networking equipment and data centers
• Advanced telecommunications infrastructure
• Medical imaging and diagnostic equipment
• Aerospace and defense systems
• High-speed computing and server motherboards
• Industrial automation and control systems

Manufacturing Capabilities

• Quick-turn prototypes: 10-15 business days
• Production runs: 15-25 business days
• Panel sizes up to 18″ x 24″
• Minimum order quantity: 5 pieces
• Volume production capabilities up to 10,000+ units

Why Choose Our 20-Layer PCB Service

Our experienced engineering team works closely with your design requirements to ensure optimal performance. We provide comprehensive design rule checks, signal integrity analysis, and manufacturing recommendations to maximize your product’s reliability and performance.

Get Started Today Contact our technical team for a custom quote, design consultation, or to discuss your specific ultra-complex circuit requirements. We’re ready to bring your most challenging PCB designs to life.

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Our 16-layer PCB manufacturing service delivers precision-engineered high-density boards designed for complex electronic systems requiring superior performance and reliability. These advanced multi-layer printed circuit boards provide exceptional signal integrity, power distribution, and component density capabilities for demanding applications.

Key Features:

• 16 copper layers with optimized stack-up configurations
• High-density interconnect (HDI) technology supporting fine-pitch components
• Advanced via structures including blind, buried, and micro vias
• Controlled impedance matching for high-speed digital signals
• Tight tolerance manufacturing with ±0.1mm precision
• Multiple surface finishes including HASL, ENIG, and OSP
• Comprehensive testing including electrical, mechanical, and visual inspection

Technical Capabilities:

• Minimum trace width: 0.075mm (3 mil)
• Minimum via size: 0.1mm (4 mil)
• Layer thickness control: ±10%
• Impedance tolerance: ±5%
• Board thickness: 0.8mm to 6.0mm
• Maximum board size: 610mm x 457mm

Applications: Perfect for telecommunications equipment, aerospace systems, medical devices, high-performance computing, automotive electronics, and industrial control systems where space optimization and signal integrity are critical.

Quality Assurance: Manufactured to IPC-A-600 Class 2/3 standards with full traceability, AOI inspection, and comprehensive electrical testing. ISO 9001 certified facility ensures consistent quality and reliability.

Lead Time: 10-15 business days for standard specifications, with expedited options available for urgent projects.

Contact us for custom stack-up design consultation and competitive pricing for your high-density PCB requirements.

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Key Features:

• 12 conductive layers with optimized copper distribution for enhanced current carrying capacity
• Advanced dielectric materials including high-frequency laminates and low-loss substrates
• Controlled impedance matching for critical signal paths and differential pairs
• Dedicated power and ground planes for clean power distribution and EMI shielding
• HDI (High Density Interconnect) capabilities with microvias and blind/buried vias
• Flexible layer configuration customizable to your specific design requirements

Applications: Perfect for high-speed digital systems, RF/microwave circuits, telecommunications equipment, aerospace electronics, medical devices, and advanced computing platforms where signal integrity and power efficiency are critical.

Technical Specifications:

• Layer count: 12 layers
• Board thickness: 1.6mm – 3.2mm (customizable)
• Minimum trace width: 0.1mm (4 mil)
• Via sizes: 0.15mm – 0.8mm
• Copper weight: 1oz – 4oz per layer
• Dielectric materials: FR4, Rogers, Isola, Nelco, and other high-performance substrates
• Surface finishes: HASL, ENIG, OSP, Immersion Silver, Hard Gold

Quality Assurance: Each 12-layer PCB undergoes rigorous testing including electrical continuity, impedance verification, thermal cycling, and automated optical inspection to ensure consistent performance and reliability.

Ideal for engineers and manufacturers requiring sophisticated PCB solutions that deliver exceptional performance in space-constrained, high-frequency applications.

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Our 10-layer PCB production service delivers precision-engineered multilayer circuits designed for demanding applications in telecommunications, aerospace, medical devices, and high-speed computing systems. With decade-proven expertise in complex PCB fabrication, we transform your most challenging designs into reliable, high-performance circuit boards.

Key Features

Superior Layer Construction

• 10 copper layers with optimized impedance control
• Ultra-thin dielectric materials for signal integrity
• Controlled layer stackup for minimal crosstalk
• Sequential lamination process ensuring perfect layer alignment

Advanced Manufacturing Capabilities

• Minimum trace width: 0.075mm (3 mil)
• Via drilling precision: ±0.025mm tolerance
• Aspect ratio support up to 12:1
• HDI (High Density Interconnect) technology available
• Blind and buried vias for space optimization

Premium Materials & Finishes

• FR-4 high-Tg materials for thermal stability
• Rogers and Isola specialty substrates available
• Multiple surface finishes: HASL, ENIG, OSP, Immersion Silver
• RoHS compliant materials and processes

Technical Specifications

Physical Parameters

• Board thickness: 1.6mm – 3.2mm
• Copper weight: 0.5oz – 4oz per layer
• Minimum hole size: 0.1mm
• Maximum board size: 600mm × 500mm
• Layer count: 10 layers standard (up to 32 layers available)

Electrical Performance

• Impedance tolerance: ±5% (±10% standard)
• Insulation resistance: >10^8 MΩ
• Dielectric withstanding voltage: 500V AC
• Thermal shock resistance: 288°C for 10 seconds

Quality Assurance

Every 10-layer PCB undergoes rigorous testing protocols including electrical testing, impedance verification, microsection analysis, and automated optical inspection. Our ISO 9001:2015 certified facility maintains strict quality standards with 99.5% first-pass yield rates.

Applications

High-Speed Digital Systems

• Server motherboards and networking equipment
• Graphics cards and high-performance computing
• 5G telecommunications infrastructure

Mission-Critical Electronics

• Aerospace avionics and defense systems
• Medical imaging and diagnostic equipment
• Industrial automation and control systems

Advanced Consumer Electronics

• Smartphones and tablets with complex RF circuits
• Automotive infotainment and ADAS systems
• IoT devices requiring miniaturization

Production Timeline

• Standard lead time: 10-15 business days
• Expedited service: 7-10 business days available
• Prototype quantities: 5-100 pieces
• Production volumes: 100-10,000+ pieces

Design Support Services

Our experienced engineering team provides comprehensive design for manufacturing (DFM) analysis, impedance calculations, and stackup optimization to ensure your 10-layer PCB meets all performance requirements while maintaining cost-effectiveness.

Get Started Today Upload your Gerber files for instant quote or contact our technical team for design consultation. We’re committed to delivering exceptional multilayer PCBs that power tomorrow’s innovations.

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Our 4-layer PCB manufacturing service delivers reliable, high-performance printed circuit boards engineered for applications requiring enhanced signal integrity, reduced electromagnetic interference, and compact form factors. These standard multilayer boards feature four conductive copper layers separated by insulating dielectric materials, providing superior routing density and electrical performance compared to single or double-layer alternatives.

Key Features:

• Enhanced Signal Integrity: Dedicated power and ground planes reduce noise and crosstalk while providing stable voltage distribution
• Improved EMI Performance: Internal ground planes act as natural shields, minimizing electromagnetic interference
• Higher Component Density: Multiple routing layers enable complex circuit designs in compact spaces
• Better Thermal Management: Internal copper planes efficiently dissipate heat across the board
• Reduced Loop Inductance: Shorter return paths between signal and ground planes improve high-frequency performance

Technical Specifications:

• Layer Stack-up: Signal/Ground/Power/Signal configuration (customizable)
• Board Thickness: 1.6mm standard (0.8mm to 3.2mm available)
• Copper Weight: 1oz standard (0.5oz to 2oz options)
• Via Types: Through-hole, blind, and buried vias supported
• Minimum Trace Width: 0.1mm (4 mil)
• Minimum Via Size: 0.15mm (6 mil)
• Surface Finishes: HASL, OSP, ENIG, Immersion Silver, Immersion Tin

Applications: Perfect for telecommunications equipment, automotive electronics, medical devices, industrial control systems, consumer electronics, and IoT devices where space optimization and signal quality are critical.

Quality Assurance: All boards undergo comprehensive testing including electrical continuity, impedance control verification, and automated optical inspection to ensure consistent quality and reliability.

Lead Times: Standard production: 5-7 business days Express service: 2-3 business days available

Ready to bring your complex electronic designs to life with professional 4-layer PCB manufacturing that meets your performance requirements and delivery timelines.

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Our advanced multilayer PCB manufacturing service delivers industry-leading printed circuit boards with exceptional complexity and reliability. Supporting configurations from 4 to 64 layers, we provide the high-density interconnect solutions that modern electronics demand.

Key Features

Layer Count Flexibility: Design freedom with 4 to 64 conductive layers, enabling compact designs with maximum functionality density.

Advanced Materials: Premium FR-4, high-frequency materials, and specialized substrates including Rogers, Taconic, and polyimide for demanding applications.

Precision Manufacturing: State-of-the-art equipment ensures accurate layer-to-layer alignment with registration tolerances as tight as ±0.025mm.

High-Density Interconnect (HDI): Microvias, blind vias, and buried vias support miniaturization while maintaining signal integrity.

Controlled Impedance: Precise impedance matching for high-speed digital and RF applications, with tolerances of ±5% or better.

Technical Specifications

• Layer Count: 4-64 layers
• Board Thickness: 0.4mm to 6.4mm
• Minimum Trace Width: 0.075mm (3 mil)
• Minimum Via Size: 0.1mm (4 mil)
• Copper Weight: 0.5oz to 6oz per layer
• Surface Finish: HASL, ENIG, OSP, Immersion Silver, Hard Gold
• Solder Mask: Multiple colors with fine feature resolution
• Silkscreen: White, black, or custom colors with 0.1mm minimum feature size

Applications

Our multilayer PCBs serve critical applications across industries including aerospace, medical devices, telecommunications, automotive electronics, industrial controls, and high-performance computing systems. These boards excel in applications requiring high component density, excellent thermal management, and superior electromagnetic compatibility.

Quality Assurance

Every board undergoes comprehensive testing including electrical continuity, insulation resistance, impedance verification, and dimensional inspection. Our ISO 9001:2015 certified facility maintains strict quality controls throughout the manufacturing process.

Advanced Capabilities

Embedded Components: Integration of resistors, capacitors, and other passive components within the PCB stackup for ultimate miniaturization.

Thermal Management: Specialized thermal interface materials and heat dissipation structures built into the board design.

Flex-Rigid Construction: Seamless integration of flexible and rigid sections for complex three-dimensional assemblies.

Sequential Lamination: Advanced buildup techniques for ultra-high layer count boards with maintained reliability.

Transform your most demanding electronic designs into reality with our advanced multilayer PCB manufacturing. Contact our engineering team to discuss your specific requirements and leverage our expertise in complex board fabrication.

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