Layers: 6 Layer PCB
Material: RO3003+FR4
Special process: hole in disk + impedance + blind buried hole 1-2
Minimum hole diameter: blind hole 0.1mm, through hole 0.2mm
Outer layer line width/spacing: 5/2.5mil
Surface Process: OSP
PCB thickness: 1.6mm
What’s Rogers RO3003 + FR4 hybrid PCB board
Rogers RO3003 and FR4 are two different materials used in the manufacturing of printed circuit boards (PCBs). The combination of these two materials in a hybrid PCB board can provide a balance between performance and cost-effectiveness for certain applications.
Rogers RO3003 is a high-frequency laminate material that is designed for use in applications that require low loss and consistent electrical performance up to high frequencies. It is a thermoset ceramic-filled hydrocarbon material with a relatively high dielectric constant and low dissipation factor, making it suitable for high-speed digital and RF/microwave applications.
FR4 (Flame Retardant 4) is a glass-reinforced epoxy laminate material that is widely used in the manufacturing of conventional PCBs. It is a cost-effective material with good mechanical and electrical properties, but it has higher signal loss and lower performance compared to materials like , especially at higher frequencies.
The combination of RO3003 and FR4 in a hybrid PCB board allows for the selective placement of the high-performance RO3003 material in critical areas of the circuit, such as high-speed or high-frequency signal paths, while using the more cost-effective FR4 material for other areas of the board. This hybrid approach can provide a balance between performance and cost, making it suitable for applications that require both high-frequency performance and cost optimization.
Hybrid PCB boards with RO3003 and FR4 are often used in applications such as wireless communication systems, radar systems, satellite communication systems, and other high-frequency or high-speed electronic devices where signal integrity and cost are both important factors.
It’s important to note that the design and layout of a hybrid PCB board require careful consideration to ensure proper signal integrity and minimize potential issues such as signal reflections or crosstalk between the different materials.
