Rogers CuClad�� laminates are advanced woven fiberglass/PTFE composite materials engineered for high-frequency printed circuit board substrates and radome applications. These microwave-grade laminates combine the superior electrical properties of polytetrafluoroethylene (PTFE) with the mechanical stability of woven fiberglass reinforcement, delivering exceptional performance for demanding RF and microwave applications.

Key Features

Superior Material Design

• Cross-plied woven fiberglass construction with alternating plies oriented 90簞 to each other
• High PTFE to glass ratio for optimal electrical performance
• Precision-controlled fiberglass/PTFE ratio enabling a range of dielectric constant options
• True electrical and mechanical isotropy in the X-Y plane – unique among PTFE-based laminates

Exceptional Electrical Performance

• Ultra-low dielectric constants ranging from 2.17 to 2.60
• Extremely low electrical loss with dissipation factors from 0.0009 to 0.0017 at X-band
• Superior dielectric constant uniformity compared to non-woven fiberglass reinforced laminates
• Stable performance across frequency range ensuring consistent signal integrity

Outstanding Thermal Properties

• Low moisture absorption (0.02-0.03%)
• Controlled thermal coefficient of dielectric constant
• Excellent thermal stability for high-temperature applications
• Low outgassing characteristics suitable for aerospace applications

Product Variants

CuClad 217 (庰r = 2.17, 2.20)

• Lowest dielectric constant available in fiberglass-reinforced PTFE laminates
• Ultra-low dissipation factor of 0.0009 @ 10 GHz
• Fastest signal propagation with highest signal-to-noise ratios
• Optimal for ultra-high frequency applications requiring minimal signal loss

CuClad 233 (庰r = 2.33)

• Balanced performance with medium fiberglass/PTFE ratio
• Improved dissipation factor of 0.0013 @ 10 GHz
• Enhanced mechanical properties without sacrificing electrical performance
• Ideal for applications requiring both low loss and mechanical stability

CuClad 250 (庰r = 2.40-2.60)

• Superior mechanical properties approaching conventional substrates
• Enhanced dimensional stability with lower thermal expansion
• Dissipation factor of 0.0017 @ 10 GHz
• Perfect for applications demanding maximum mechanical reliability

Technical Specifications

Primary Applications

Military & Defense Electronics

• Radar systems (ECM, ESM)
• Electronic warfare equipment
• Avionics systems
• Communications, navigation, and identification (CNI) systems

Commercial Microwave Components

• Low noise amplifiers (LNAs)
• RF filters and couplers
• Phase-sensitive filters
• Antenna systems and radomes

High-Frequency Communications

• 5G wireless infrastructure
• Automotive radar sensors (77 GHz)
• Satellite communication systems
• Millimeter-wave applications

Specialized Applications

• Phased array antennas requiring electrical isotropy
• Microstrip and stripline circuits
• High-reliability aerospace systems
• Ultra-low loss signal transmission systems

Material Availability & Options

Copper Cladding Options

• Standard: 1/2, 1, or 2 oz electrodeposited copper on both sides
• Custom: Other copper weights and rolled copper foil available
• Ground plane bonding available with aluminum, brass, or copper plates for heat sinking

Panel Sizes

• Cross-plied configuration: 36″ �� 36″ master sheets
• Parallel-plied configuration: 36″ �� 48″ master sheets
• Custom sizes available upon request

Quality Grades

• Standard grade for general applications
• “LX” testing grade for critical performance applications with individual sheet testing and certification

Benefits & Advantages

Performance Benefits

• Faster signal propagation due to low dielectric constants
• Reduced signal loss at high frequencies
• Enhanced signal-to-noise ratios for improved system performance
• Frequency-stable characteristics simplifying multi-band designs

Manufacturing Advantages

• Compatible with standard PCB processing techniques
• Excellent dimensional stability for high-yield manufacturing
• Reliable plated through-hole performance due to low thermal expansion
• Process chemical resistance ensuring fabrication reliability

Design Flexibility

• Range of dielectric constants for application-specific optimization
• True X-Y plane isotropy critical for phased array applications
• Consistent material properties enabling reliable multi-layer designs
• Proven reliability in demanding aerospace and military applications

Environmental & Safety Compliance

• RoHS compliant materials
• REACH regulation compliant with no SVHC substances
• UL94-V0 flammability rating for safety-critical applications
• Low outgassing meeting NASA space application requirements
• Halogen-free options available for environmentally sensitive applications

Rogers CuClad簧 laminates represent the industry standard for high-performance PTFE-based circuit materials, offering unmatched combination of electrical performance, mechanical reliability, and manufacturing consistency for the most demanding high-frequency applications.

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Rogers Corporation, a global leader in engineered materials with over 190 years of innovation, offers cutting-edge flexible circuit solutions designed to power, protect, and connect the modern world. Rogers flexible PCBs provide high-frequency performance and flexibility, making them ideal for applications where space is limited and high-frequency performance and reliability are critical.

Key Features & Benefits

Superior Electrical Performance

• High-Frequency Excellence: Rogers laminates offer superior dielectric constant and temperature stability when compared with standard FR4 materials
• Low Loss Technology: Engineered for minimal signal loss at microwave and RF frequencies
• Controlled Impedance: Rogers materials offer uniform controlled impedance with minimum tolerance in contrast to standard FR-4 materials

Advanced Material Properties

• Temperature Stability: Excellent performance across extreme temperature ranges
• Moisture Resistance: Minimal water absorption characteristic makes it appropriate for use in high-humidity applications
• Chemical Resistance: Superior resistance to harsh environmental conditions
• Dimensional Stability: Maintains form factor integrity under stress

Mechanical Flexibility

• Dynamic Bend Capability: Flexible PCBs are thin, lightweight, and can be bent or folded to fit into tight spaces
• Durability: More durable and resistant to vibration and shock, which makes them ideal for use in harsh environments
• Compact Design: Enables lighter, more compact electronic assemblies

Technical Specifications

Material Composition

• Base Materials: Composite of ceramic and polymer materials that provide excellent dielectric properties, low loss, and high thermal conductivity
• Conductor: Thin layer of copper foil for electrical connectivity
• Substrate Options: Various Rogers material series including RO4000簧, RO3000簧, and specialized flexible formulations

Performance Characteristics

• Frequency Range: Optimized for microwave and millimeter wave applications
• Dielectric Constant: Precisely controlled for consistent signal integrity
• Loss Tangent: Ultra-low loss for high-frequency applications
• Thermal Conductivity: Enhanced heat dissipation capabilities

Applications

Aerospace & Defense

Rogers flexible PCBs are commonly used in aerospace, military applications, where high-frequency performance and reliability are critical. These applications benefit from:

• Radar systems and antenna arrays
• Avionics equipment requiring temperature stability
• Communication systems in harsh environments

Medical Electronics

• Implantable devices requiring biocompatibility
• Portable medical equipment
• High-precision diagnostic instruments

Consumer Electronics

• Mobile devices and smartphones
• Wearable technology
• Compact electronic assemblies

Automotive

• Advanced driver assistance systems (ADAS)
• Vehicle radar and communication systems
• Electric vehicle power management

Industrial Applications

• High-power RF systems
• Telecommunications infrastructure
• IoT and connected devices

Manufacturing Excellence

Processing Advantages

Rogers materials can be processed similarly to FR-4, enabling efficient manufacturing while delivering superior performance. The materials are compatible with standard PCB fabrication processes including:

• Chemical surface preparation
• Plating and metallization
• Lamination and bonding
• Precision drilling and routing

Quality Assurance

Rogers Corporation maintains strict quality standards with:

• ISO-certified manufacturing facilities
• Comprehensive testing protocols
• Global supply chain reliability
• Technical support and design collaboration

Competitive Advantages

1. Industry Leadership: Rogers RO4000 hydrocarbon ceramic laminates and prepregs are the industry leader
2. Proven Reliability: Decades of proven performance in mission-critical applications
3. Design Flexibility: Customizable solutions for specific application requirements
4. Global Support: Worldwide technical support and manufacturing capabilities
5. Innovation: Continuous R&D investment in next-generation materials

Conclusion

Rogers flexible circuit solutions represent the pinnacle of high-performance flexible electronics technology. Whether for aerospace, medical, automotive, or consumer applications, these advanced materials deliver unmatched reliability, performance, and design flexibility. Rogers flexible circuit boards play a critical role in the design and production of electronic devices, enabling engineers to create innovative solutions that meet the demanding requirements of today’s advanced electronic systems.

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Rogers DiClad laminates are woven fiberglass reinforced PTFE-based composites designed for use as printed circuit board substrates in high frequency applications. The controlled fiberglass and PTFE content ratio enables DiClad laminates to offer a range of low dielectric constant (Dk) values.

Key Material Composition

DiClad laminates are PTFE with woven fiberglass composite materials used for PCB substrates. The unique blend of fibers and composite materials provides dissipation factor flexibility and low dielectric constant. Unlike the CuClad簧 laminate series, the DiClad laminates do not have cross plied constructions.

DiClad Series Variants

DiClad 870/880 Series

By using fewer plies of woven fiberglass and a higher ratio of PTFE content, the DiClad 870 and DiClad 880 laminates offer lower dielectric constants (Dk) and dissipation factors. The dielectric constant of Rogers DiClad 870/880 laminates is 2.60.

DiClad 527 Series

DiClad 527 laminates offer a higher ratio of fiberglass reinforcement to PTFE content. This carefully controlled ratio provides a higher dielectric constant.

Technical Performance Characteristics

Electrical Properties

• Low Dielectric Constant: Higher PTFE content provides a lower Dk and loss tangent, while higher fiberglass content provides better dimensional stability and registration.
• Frequency Stability: The stability of the Dielectric Constant of DiClad over frequency ensures easy design transition and scalability of design.
• Low Loss Tangent: Extremely Low Loss Tangent with Excellent Dimensional Stability

Physical Properties

• Dimensional Stability: Rogers DiClad 870/880 offers excellent temperature stability, low moisture absorption, and a uniform coefficient of thermal expansion.
• Thermal Performance: The thin metal cladding used in these laminates helps improve thermal stability.
• Panel Size: These laminates are available in sizes up to 48��� x 54���.

Key Benefits

Superior RF Performance

• Low dielectric constant for reduced signal losses
• Excellent frequency stability across the electromagnetic spectrum
• Electrical Properties are highly uniform across frequency

Manufacturing Advantages

• The materials are compatible with standard PTFE-based printed circuit board substrates.
• All of the boards are 100% electrical tested before shipment.
• Lead-free process compatible

Reliability Features

• Low moisture absorption
• Consistent Mechanical Performance
• These materials are ideal for use on high-reliability PCBs.

Target Applications

High-Frequency Electronics

• These materials are suitable for microwave and millimeter-wave applications.
• The high-frequency Rogers laminate is ideal for digital PCB applications requiring high-speed performance at 10 GHz.

Industry Sectors

• 5G Wireless Communication: ACS Materials are a consistent and reliable choice for applications including 5G wireless communication
• Automotive: automotive radar sensors
• Aerospace & Defense: aerospace, satellites
• RF/Microwave Systems: Rogers DiClad 870/880 an ideal choice for RF/microwave applications.

Manufacturing Specifications

Quality Standards

• The boards are manufactured as per IPC Class II standard.
• Product Performance Uniformity

Processing Compatibility

• Compatible with standard PCB fabrication processes
• Suitable for both prototype and production volumes
• Works with conventional copper plating and etching processes

Competitive Advantages

Rogers DiClad Woven Glass Substrates offer designers a superior alternative to traditional FR-4 materials for high-frequency applications, providing:

1. Predictable Performance: Stable electrical properties across temperature and frequency ranges
2. Design Flexibility: Range of dielectric constants to optimize circuit performance
3. Manufacturing Reliability: Proven compatibility with standard PCB processes
4. Cost-Effective Solution: Balance of performance and manufacturability for volume production

Summary

Rogers DiClad Woven Glass Substrates represent a proven solution for high-frequency PCB applications where signal integrity, dimensional stability, and manufacturing reliability are critical. The carefully engineered PTFE/woven glass composition delivers consistent electrical performance while maintaining compatibility with standard fabrication processes, making these materials ideal for next-generation RF, microwave, and high-speed digital applications.

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Key Features and Benefits

Electrical Performance:

• Dielectric constant ranges from 3.19 to 3.35 across different thicknesses
• Low dissipation factor from 0.0033 to 0.0044
• Excellent dielectric constant control for repeatable electrical performance
• High frequency performance suitable for microwave and millimeter wave applications

Thermal Characteristics:

• Low z-axis coefficient of thermal expansion ranging from 43 to 60 ppm/簞C
• Glass transition temperature (Tg) ranging from 176簞C to 188簞C
• Decomposition temperature (Td) of approximately 397-408簞C
• UL 94 V-0 flame retardant rating

Processing Advantages:

• Compatible with standard epoxy/glass (FR-4) processes
• Sequential lamination capable – fully cured RO4000 products can withstand multiple lamination cycles
• Lead-free solder processing compatible
• Suitable for UV and CO2 laser processing for micro-blind holes and through holes

Available Configurations

Standard Thicknesses: Available in 2.5, 3.0, 3.5, 4.0, 4.5, 5.0, and 6.0 mil thicknesses with 簣0.0006″ tolerance

Panel Sizes: Standard configurations include 16″ �� 18″, 24″ �� 18″, 24.5″ �� 18.5″, and 24″ �� 36″ panels

Multilayer Construction Capabilities

RO4450T bonding materials are compatible in multilayer board constructions with RO4003C, RO4350B, RO4835, RO4360G2, and RO4000 LoPro laminates, making them ideal for hybrid constructions that combine high-performance RF layers with cost-effective FR-4 materials.

The material demonstrates excellent CAF (Conductive Anodic Filament) resistance and provides high reliability plated through-hole performance, critical for complex multilayer designs requiring superior electrical and mechanical reliability.

Target Applications

Primary applications include backhaul radios, communications systems, power amplifiers, and small cells/DAS (Distributed Antenna Systems). The material is particularly well-suited for advanced millimeter wave multi-layer designs ��where consistent electrical performance and thermal reliability are paramount.

Rogers 4450T represents a comprehensive bonding solution that bridges the gap between high-performance RF requirements and manufacturing efficiency, offering designers the flexibility to create sophisticated multilayer constructions while maintaining compatibility with established PCB fabrication processes.

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The Rogers TC350 Enhanced Resin System offers designers a unique combination of low insertion loss and higher thermal conductivity, enabling superior reliability and reduced operating temperatures in high power applications.

Product Overview

TC350 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite designed for use as a printed circuit board substrate. This material is engineered to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss.

Key Technical Specifications

Electrical Properties:

• Dielectric Constant: 3.50 簣 0.05 @ 10 GHz
• Dissipation Factor: 0.0020 @ 10 GHz (typical)
• Thermal Coefficient of Dielectric Constant: -9 ppm/簞C (-50簞C to 150簞C)

Thermal Properties:

• Thermal Conductivity: 0.72-1.00 W/m/K @ 50簞C
• Coefficient of Thermal Expansion: 7 ppm/簞C (X,Y), 23 ppm/簞C (Z)

Physical Properties:

• Density: 2.3 g/cm糧
• Peel Strength: 7.0 lbs/in (1.2 N/mm)
• UL94 V-0 Flammability Rating
• Lead-Free Process Compatible

Key Benefits

Superior Thermal Management: The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. ��This higher heat transfer within the substrate complements designs using coins, heat sinks or thermal vias to provide designers additional design margin in managing heat.

Enhanced Reliability: Lower operating temperatures and chip-matching thermal expansion characteristics provide better reliability for component attachment prone to solder fatigue, solder softening and joint failure.

Excellent Processing Characteristics: The advanced filler system allows this composite to possess improved drilling performance, resulting in reduced manufacturing costs. TC350 utilizes relatively smooth copper, unlike ceramic hydrocarbons that need to utilize “toothy copper” to achieve acceptable bond.

Applications

TC350 laminates are used in a range of applications including Amplifiers, Combiners, Power Dividers, Couplers and Filters. ��Applicable markets range from Commercial and Consumer to Defense and Aerospace.

Ideal for:

• High-power microwave applications
• Power amplifiers requiring thermal management
• Temperature-sensitive passive components
• RF circuits demanding phase stability
• Industrial heating applications

Manufacturing & Availability

TC350 laminate is supplied with 1/2, 1 or 2 ounce electrodeposited or reverse treat copper on both sides.The material is available in various panel sizes to accommodate multiple circuit layouts and reduce processing costs.

The Rogers TC350��� Enhanced Resin System represents a cost-effective solution for designers requiring high thermal performance, low losses, and reliable processing characteristics in demanding high-frequency applications.

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Rogers RT/Duroid 6002 is a pioneering ceramic-filled PTFE composite microwave material specifically engineered for high-frequency applications demanding superior electrical and mechanical performance. This advanced substrate represents the first low-loss, low dielectric constant laminate designed to enable complex microwave structures that are both mechanically reliable and electrically stable.

Key Electrical Properties

Dielectric Performance:

• Dielectric constant (庰r): 2.94 簣 0.04 at 10 GHz, providing stable and predictable signal propagation
• Dissipation factor (tan 帤): 0.0012 at 10 GHz, ensuring excellent low-loss performance
• Thermal coefficient of dielectric constant: +12 ppm/簞C (0-100簞C), delivering exceptional temperature stability

Signal Integrity:

• Extremely low thermal coefficient of dielectric constant from -55簞C to +150簞C (-67簞F to 302簞F)
• Volume resistivity: 10��� Mohm繚cm and surface resistivity: 10��� Mohm
• Frequency range: Stable performance up to 10 GHz and beyond

Mechanical & Thermal Characteristics

Dimensional Stability:

• Excellent dimensional stability (0.2 to 0.5 mils/inch) achieved by matching X and Y coefficient of expansion to copper
• Low Z-axis coefficient of thermal expansion ensuring reliable plated through-holes
• Successfully temperature cycled (-55簞C to 125簞C) for over 5000 cycles without via failure

Thermal Management:

• Thermal conductivity: 0.60 W/m/K at 80簞C
• Decomposition temperature (Td): 500簞C
• Low moisture absorption: 0.02%

Manufacturing Specifications

Available Configurations:

• Standard thicknesses: 0.010″ to 0.060″ (0.252mm to 1.524mm) with tight tolerances
• Standard panel sizes: 18″ �� 12″ and 18″ �� 24″
• Copper cladding options: 翻 oz. to 2 oz./ft簡 electrodeposited or rolled copper
• Alternative claddings available: aluminum, brass, copper plates, and resistive foils

Quality Certifications:

• UL94 V-0 flammability rating
• Lead-free process compatible
• Low outgassing properties ideal for space applications

Primary Applications

Aerospace & Defense:

• Phased array antennas and ground-based/airborne radar systems
• Global positioning system antennas
• Commercial airline collision avoidance systems

RF/Microwave Systems:

• High reliability complex multilayer circuits
• Power backplanes and beam forming networks
• Filters, oscillators, and delay lines requiring electrical stability

Emerging Technologies:

• 5G communication equipment and Internet of Things applications
• Automotive radar and communication systems
• Satellite communication systems

Competitive Advantages

Performance Benefits:

• Superior temperature stability addressing defects found in traditional PTFE substrates
• Low tensile modulus reducing stress on solder joints and improving surface mount reliability
• Reliable for use in multi-layer board constructions

Design Flexibility:

• Suitable for flat and non-planar structures including complex antenna designs
• Compatible with standard FR4 PCB manufacturing processes��
• Enables miniaturization through stable dielectric properties

Rogers RT/Duroid 6002 represents the industry standard for demanding high-frequency applications where reliability, performance, and dimensional stability are critical. Its proven track record in aerospace, defense, and commercial RF applications makes it the preferred choice for engineers designing next-generation microwave and millimeter-wave systems.

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Rogers RT/duroid 6035HTC is a premium ceramic-filled PTFE (polytetrafluoroethylene) composite laminate specifically engineered for demanding high-power RF and microwave applications. This advanced circuit board material delivers exceptional thermal management capabilities combined with outstanding electrical performance, making it the ideal choice for applications where heat dissipation and signal integrity are critical.

Key Features & Benefits

Superior Thermal Performance

• High Thermal Conductivity: 1.44 W/m/簞K – approximately 2.4 times higher than standard RT/duroid 6000 series materials
• Enhanced Heat Dissipation: Enables significantly lower operating temperatures in high-power applications
• Excellent Long-Term Thermal Stability: Maintains performance characteristics under sustained high-temperature conditions

Outstanding Electrical Properties

• Low Dielectric Constant: 3.50 簣 0.05 (process), 3.60 (design) at 10 GHz
• Ultra-Low Loss Tangent: 0.0013 at 10 GHz for minimal signal loss
• Excellent Temperature Stability: Thermal coefficient of dielectric constant: -66 ppm/簞C
• High Volume Resistivity: 1��10��� Mohm for superior insulation

Advanced Manufacturing Benefits

• Superior Drillability: Rogers’ advanced filler system eliminates hard alumina fillers, significantly reducing drilling costs and extending tool life
• Excellent Dimensional Stability: Low coefficient of thermal expansion (X: 19 ppm/簞C, Y: 19 ppm/簞C, Z: 39 ppm/簞C)
• Strong Copper Adhesion: 7.9 lbs/in. peel strength with ED copper foil
• Lead-Free Process Compatible: Suitable for RoHS-compliant manufacturing

Technical Specifications

Primary Applications

High-Power RF & Microwave Systems

• Power amplifiers for cellular base stations
• High-power RF amplifiers
• Radar and satellite communication systems
• Military and aerospace electronics

Circuit Components

• Couplers and power dividers
• High-power filters and combiners
• Microwave antennas
• Power distribution networks

Industrial Applications

• Automotive radar systems
• Wireless infrastructure equipment
• Medical RF equipment
• High-frequency test equipment

Why Choose Rogers 6035HTC?

Thermal Management Excellence: The enhanced thermal conductivity allows for effective heat dissipation in high-power applications, preventing component overheating and extending system reliability.

Cost-Effective Manufacturing: Unlike traditional high thermal conductivity laminates that use alumina fillers, the 6035HTC’s advanced filler system provides excellent machinability, reducing drilling costs and manufacturing complexity.

Proven Reliability: Part of Rogers’ renowned RT/duroid family with decades of proven performance in demanding applications worldwide.

Design Flexibility: Available in various thicknesses to accommodate different design requirements and impedance specifications.

Quality & Compliance

• IPC-Class-2 Standard: Meets rigorous industry quality standards
• UL94 V-0 Flammability Rating: Ensures safety in critical applications
• RoHS Compliant: Lead-free process compatible for environmental compliance
• ISO Certified Manufacturing: Consistent quality and reliability

Rogers RT/duroid簧 6035HTC represents the pinnacle of high-temperature, high-frequency circuit board technology, delivering unmatched performance for the most demanding RF and microwave applications where thermal management and electrical performance are paramount.

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Rogers TMM��(Thermoset Microwave Materials) represent a breakthrough family of high-performance laminates that combine the best characteristics of ceramic substrates with the processing ease of traditional polymer materials. These ceramic, hydrocarbon, and thermosetting polymer composite materials are specifically designed for high reliability stripline and microstrip line applications with electroplated through-holes .

Key Performance Features

Exceptional Thermal Stability

• Very low dielectric constant thermal coefficient, typically less than 30 ppm/簞C
• Thermal conductivity between 0.70 and 0.76 W/mK – approximately twice that of traditional PTFE/ceramic laminates
• Coefficient of thermal expansion matched to copper allowing for high reliability of plated through-holes

Superior Electrical Properties

• Dielectric constants ranging from 3 to 13 across the product series
• Low dissipation factors between 0.0019 and 0.0023 at 10 GHz
• Dielectric constant uniformity and low thermal coefficient of dielectric constant

Mechanical Excellence

• Isotropic coefficient of thermal expansion closely matching copper
• Thermosetting resin base prevents softening when heated, enabling reliable wire bonding without pad lifting or substrate deformation
• Resistant to process chemicals, no damage to material during fabrication and assembly processes

Product Portfolio

The TMM series includes multiple variants optimized for different applications:

• TMM3: Dielectric constant ranging from approximately 3.0 to 3.4, suitable for high-frequency communication systems, satellite communications, and phased array antennas
• TMM4: Dielectric constant typically around 4.5 to 5.0, commonly used in microwave circuit substrates and RF applications
• TMM6: Stable dielectric constant of 6.15 across a wide frequency range
• TMM10 & TMM10i: TMM10i with Dk = 10, Dissipation Factor = 0.002
• TMM13i: Hydrocarbon Ceramic Isotropic Thermosetting Microwave Material specially designed for stripline and microstrip line applications requiring high through-hole reliability

Manufacturing Advantages

TMM laminates offer obvious processing advantages compared with alumina filler substrates, providing larger specifications of copper clad and enabling use of standard PCB substrate processing procedures. Unlike traditional materials, TMM laminates do not require sodium naphthenate treatment before electroless plating

Available Specifications:

• Thicknesses from 0.015 to 0.500 inches with tolerance of 簣0.0015 inches
• Compatible with 1/2 oz/ft簡 to 2 oz/ft簡 electrodeposited copper foil
• All dielectric variants can be produced as molded, 3-dimensional shapes

Target Applications

Primary Markets:

• RF and microwave circuits, GPS antennas, power amplifiers and combiners
• Microstrip antennas, filters and couplers, dielectric polarizers and lenses
• Satellite communication systems
• 5G infrastructure, radar systems, satellite communications, test and measurement equipment
• Space-borne equipment applications where extreme temperature variations (-55簞C to +150簞C) are encountered

Competitive Advantages

Rogers TMM materials deliver many of the advantages of ceramic laminates and traditional PTFE microwave circuit laminates without the need for specialized production technology. The series provides engineers with cost-effective solutions for high reliability applications��while maintaining the dimensional stability and electrical performance required for demanding RF and microwave circuits.

This innovative material platform enables designers to achieve superior electromagnetic performance while simplifying manufacturing processes, making TMM thermoset microwave materials the ideal choice for next-generation high-frequency electronic systems.

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Rogers Ceramic PCBs represent the pinnacle of high-temperature circuit board technology, engineered specifically for demanding applications where conventional PCB materials fail. These advanced ceramic substrates deliver exceptional thermal stability, electrical performance, and mechanical reliability in extreme operating environments up to 1000簞C and beyond.

Key Features

Superior Thermal Performance

• Operating temperature range: -55簞C to +1000簞C
• Ultra-low thermal expansion coefficient (CTE): 6-8 ppm/簞C
• Excellent thermal conductivity: 20-170 W/m繚K depending on ceramic type
• Outstanding thermal shock resistance

Exceptional Electrical Properties

• Low dielectric constant (Dk): 9.6-10.2
• Minimal dielectric loss tangent: <0.0002
• High dielectric strength: >40 kV/mm
• Excellent high-frequency performance up to millimeter-wave frequencies
• Superior electrical insulation properties

Mechanical Reliability

• High flexural strength: >300 MPa
• Excellent dimensional stability across temperature cycles
• Superior resistance to thermal fatigue
• Chemical inertness and corrosion resistance
• Hermetic sealing capability

Applications

Aerospace & Defense

• Satellite communication systems
• Radar and electronic warfare equipment
• Missile guidance systems
• High-altitude aircraft electronics
• Space-based instruments

Automotive

• Engine control modules
• Exhaust gas sensors
• Brake system electronics
• Electric vehicle power electronics
• Autonomous driving sensors

Industrial

• High-temperature sensors
• Power semiconductor modules
• Furnace control systems
• Oil and gas exploration equipment
• Chemical processing instrumentation

RF/Microwave

• High-power amplifiers
• Antenna feed networks
• Millimeter-wave circuits
• Base station equipment
• Test and measurement instruments

Technical Specifications

Material Composition

• Aluminum oxide (插梭���O���) or aluminum nitride (AlN) ceramic base
• Thick film or thin film metallization options
• Gold, silver, or platinum conductor systems
• Multiple dielectric layer capability

Physical Properties

• Thickness range: 0.25mm – 6.35mm
• Surface finish: Ra < 0.4 弮m
• Flatness: 簣25 弮m over 100mm
• Edge quality: Laser-cut or diamond-cut options

Manufacturing Standards

• IPC-6012 Class 3 compliance
• ISO 9001:2015 certified manufacturing
• MIL-STD-883 qualified processes
• RoHS compliant materials

Design Advantages

Thermal Management The ceramic substrate’s high thermal conductivity enables efficient heat dissipation, eliminating hot spots and extending component life. The low CTE ensures minimal stress on solder joints and wire bonds during thermal cycling.

Signal Integrity Low dielectric loss and stable electrical properties across temperature and frequency ranges ensure optimal signal transmission with minimal distortion, making these PCBs ideal for high-frequency applications.

Reliability The inherent stability of ceramic materials provides exceptional long-term reliability in harsh environments, reducing maintenance requirements and system downtime.

Custom Solutions

Rogers offers comprehensive design and manufacturing services including:

• Application-specific material selection
• Custom circuit layout optimization
• Prototype and production quantities
• Multi-layer constructions
• Integrated passive components
• Hermetic packaging solutions

Quality Assurance

Every Rogers Ceramic PCB undergoes rigorous testing including:

• Thermal cycling validation
• Electrical parameter verification
• Visual and dimensional inspection
• Reliability stress testing
• Certificate of compliance documentation

Support Services

Design Support

• Material selection guidance
• Thermal modeling and simulation
• RF/microwave design optimization
• Design rule verification

Manufacturing Support

• Rapid prototyping capabilities
• Volume production scaling
• Quality system integration
• Technical documentation support

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Rogers RO3003 is a high-frequency PCB material known for its excellent electrical properties, low loss, and high thermal conductivity. It is widely used in applications such as wireless communication systems, radar systems, satellite systems, and high-speed digital circuits. ��This ceramic-filled PTFE composite material is designed for commercial microwave and radio frequency applications, providing excellent electrical and mechanical stability at competitive prices.

Key Technical Specifications

Electrical Properties:

• Dielectric Constant (庰r): 3.0 簣 0.04 at 10 GHz
• Dissipation Factor (tan 帤): 0.0013 at 10 GHz
• Operating frequency range: Up to 40 GHz
• Low dielectric loss suitable for up to 77 GHz applications

Thermal Properties:

• Operating temperature range: -55簞C to +150簞C
• Thermal degradation temperature (Td): >500簞C
• Thermal conductivity: 0.5 W/mK
• Coefficient of thermal expansion (X&Y): 17 ppm/簞C
• Coefficient of thermal expansion (Z-axis): 24 ppm/簞C

Mechanical Properties:

• Moisture absorption: 0.04%
• Excellent dimensional stability with typical etch shrinkage less than 0.5 mils per inch
• Temperature coefficient of dielectric constant: -3 ppm/簞C

Key Advantages

Superior Electrical Performance:

• Low dielectric constant and low loss tangent make it ideal for ensuring minimal signal loss and precise signal propagation in high-frequency circuits
• Low loss tangent of approximately 0.0013 minimizes signal attenuation, ensuring high signal integrity and efficient transmission of microwave signals
• Stable dielectric properties over varying temperatures and frequencies

Excellent Mechanical Stability:

• Expansion coefficient matched to copper, allowing excellent dimensional stability
• Exceptional plated through-hole reliability, even in severe thermal environments
• Consistent mechanical properties regardless of dielectric constant selected

Manufacturing Benefits:

• Compatible with standard PTFE PCB processing techniques
• Suitable for use with epoxy glass multilayer board hybrid designs
• Allows designers to develop multi-layer board designs using different dielectric constant materials without warpage or reliability problems

Primary Applications

Automotive & Radar Systems:

• Radar PCB applications
• ADAS systems like adaptive cruise control, forward collision warning and active brake or lane change assist
• Automotive radar applications up to 77 GHz

Communications & Wireless:

• Antennas, RF filters, and other passive RF components
• GPS antenna PCB
• Cellular telecommunications systems, power amplifiers and antennas
• Patch antenna for wireless communications
• 5G infrastructure applications

Specialized RF Applications:

• Bandpass filters, microstrip antennas and voltage controlled oscillators
• RF coupler PCB��
• Direct broadcast satellites, datalink on cable systems
• Cost-sensitive aerospace PCB��

Manufacturing Capabilities

Our Rogers RO3003 PCB fabrication services include:

• Single and multi-layer board construction
• Various thicknesses and copper claddings available
• Precision drilling and plated through-hole processing
• Advanced etching with minimal shrinkage tolerances
• Standard PTFE PCB processing techniques with specialized handling
• Quality assurance and testing to industry standards

Why Choose Rogers RO3003?

Rogers RO3003 represents the ideal balance of performance and cost-effectiveness for high-frequency applications. With a dielectric constant in the range of 3.0 that remains stable across a wide frequency range, this material ensures minimal signal loss and accurate signal propagation ��The material’s unique ceramic-filled PTFE composition provides exceptional reliability in demanding environments while maintaining compatibility with standard PCB manufacturing processes.

For applications requiring superior RF performance, dimensional stability, and proven reliability in harsh conditions, Rogers RO3003 PCB fabrication delivers the precision and performance your high-frequency designs demand.

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