Our Multilayer Rigid Flex boards represent the pinnacle of PCB technology, seamlessly combining the structural integrity of rigid boards with the flexibility of flex circuits in a single, integrated solution. These sophisticated circuit boards feature multiple layers of conductors separated by dielectric materials, with designated flexible sections that allow for three-dimensional routing and dynamic movement.

Key Features

Hybrid Construction: Engineered with both rigid and flexible sections, enabling complex folding patterns and space-efficient designs that would be impossible with traditional rigid boards alone.

Multi-Layer Architecture: Available in configurations ranging from 4 to 20+ layers, providing extensive routing capabilities for high-density component placement and complex signal management.

Superior Signal Integrity: Controlled impedance characteristics and reduced electromagnetic interference through optimized layer stackup design and advanced materials.

Enhanced Reliability: Eliminates the need for connectors and cables between rigid sections, reducing potential failure points and improving overall system reliability by up to 85%.

Space Optimization: Enables compact, three-dimensional packaging solutions that can reduce overall product size by 30-50% compared to traditional rigid board assemblies.

Applications

Ideal for aerospace and defense systems, medical devices, automotive electronics, telecommunications equipment, and consumer electronics where space constraints, reliability requirements, and complex routing demands converge. Particularly valuable in applications requiring movement between rigid sections, such as laptop hinges, camera modules, and wearable devices.

Technical Specifications

• Layer Count: 4-20+ layers
• Flex Section Thickness: 0.1mm to 0.5mm
• Rigid Section Thickness: 0.4mm to 6.0mm
• Minimum Bend Radius: 5x total thickness
• Operating Temperature: -55簞C to +125簞C
• Dielectric Materials: Polyimide, FR-4, Rogers, and specialty materials

Our manufacturing process employs advanced lamination techniques and precision drilling to ensure consistent quality and reliability across all layers and transitions between rigid and flexible sections.

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When time-to-market is critical and your design demands the unique advantages of rigid-flex technology, our Quick Turn Rigid Flex Combined Board Rush Services deliver the speed, quality, and reliability you need to stay ahead of the competition.

What is Rigid-Flex Technology?

Rigid-flex PCBs combine the best of both worlds by integrating rigid circuit boards with flexible interconnects in a single assembly. This innovative approach eliminates the need for connectors, cables, and discrete wiring harnesses while providing exceptional mechanical reliability and space optimization.

Key Benefits

Ultra-Fast Turnaround Times

• Express 5-7 day delivery for standard configurations
• Rush 3-5 day options for urgent projects
• Same-day quoting and engineering review

Superior Design Flexibility

• Seamless integration of rigid and flexible sections
• Complex 3D geometries and space-constrained applications
• Reduced assembly time and elimination of interconnect failures

Enhanced Reliability

• Fewer connection points mean fewer failure modes
• Improved signal integrity and reduced EMI
• Extended product lifespan in high-vibration environments

Cost-Effective Solutions

• Reduced overall system costs through elimination of connectors
• Lower assembly labor requirements
• Simplified supply chain management

Technical Specifications

• Layer Count: 2-20 layers (rigid sections), 1-4 layers (flex sections)
• Board Thickness: 0.1mm – 3.2mm (rigid), 0.05mm – 0.5mm (flex)
• Minimum Via Size: 0.1mm (4 mil)
• Minimum Trace/Space: 0.075mm/0.075mm (3/3 mil)
• Bend Radius: Dynamic: 10x thickness, Static: 5x thickness
• Materials: Polyimide flex cores, FR-4 rigid sections, various coverlay options

Applications

Our Quick Turn Rigid Flex services are ideal for:

• Medical Devices: Implantables, diagnostic equipment, wearable monitors
• Aerospace & Defense: Avionics, satellite systems, military communications
• Consumer Electronics: Smartphones, tablets, wearable technology
• Automotive: Dashboard electronics, sensor systems, infotainment
• Industrial: Robotics, automation equipment, test instrumentation

Manufacturing Capabilities

Advanced Processing

• Controlled impedance matching
• Via-in-pad technology
• Blind and buried vias
• Sequential lamination processes

Quality Assurance

• IPC Class 2 and Class 3 compliance
• 100% electrical testing
• Automated optical inspection (AOI)
• Cross-sectional analysis and microsectioning

Rush Service Options

Standard Rush (5-7 days)

• Complete fabrication and assembly
• Standard material options
• Full electrical testing included

Express Rush (3-5 days)

• Priority production scheduling
• Expedited material procurement
• Dedicated engineering support

Emergency Rush (24-72 hours)

• Available for select configurations
• Premium service with dedicated resources
• Direct communication with production team

Why Choose Our Services?

With over 20 years of experience in advanced PCB manufacturing, we understand the unique challenges of rigid-flex technology. Our state-of-the-art facility, experienced engineering team, and commitment to quality ensure your critical projects are delivered on time and to specification.

Get Started Today Upload your design files for an instant quote, or contact our technical team to discuss your specific requirements. We’re ready to turn your complex designs into reality with the speed and precision your project demands.

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Our rigid-flex PCB manufacturing service delivers premium quality circuit boards that combine the stability of rigid PCBs with the flexibility of flex circuits in a single integrated solution. Perfect for space-constrained applications requiring reliable electrical connections across moving or folding components.

Key Cost Advantages

Optimized Manufacturing Process – Our streamlined production workflow reduces setup times and material waste, passing savings directly to customers while maintaining superior quality standards.

Volume Scaling Benefits – Competitive pricing tiers available for prototype quantities (1-10 pieces) through high-volume production runs (1000+ units), with significant per-unit cost reductions at higher quantities.

Reduced Assembly Costs – Eliminate expensive connectors, cables, and manual assembly steps by integrating rigid and flexible sections into one cohesive board design, reducing overall system costs by 20-40%.

Technical Specifications

• Layer Count: 2-20 layers with mixed rigid/flex stackups
• Flex Thickness: 0.1-0.4mm flexible sections
• Rigid Thickness: 0.6-3.2mm rigid sections
• Minimum Trace Width: 75弮m (3 mil)
• Via Options: Through-hole, blind, buried, and microvias
• Material Options: Polyimide flex cores with FR4 rigid sections

Applications & Industries

Ideal for aerospace, medical devices, automotive electronics, wearable technology, and high-density consumer electronics where traditional PCB solutions fall short.

Pricing Structure

• Prototype quantities: Starting at $45-85 per square inch
• Low volume (10-100): $25-55 per square inch
• Production volume (100+): $15-35 per square inch
• Express turnaround: 5-7 days (premium pricing)
• Standard delivery: 12-15 days

Contact us for detailed quotes based on your specific design requirements, layer count, and volume needs. Our engineering team provides free DFM (Design for Manufacturing) consultation to optimize your design for cost-effective production.

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The ENIG (Electroless Nickel Immersion Gold) plating process ensures excellent surface finish and protection against oxidation, enhancing the board’s durability and solderability. This gold plating is particularly crucial for optical applications, as it provides a highly reflective surface that can improve light transmission and reduce signal loss.

The integration of optical lens technology with this sophisticated PCB design allows for precise alignment and positioning of optical components, making it ideal for use in cameras, sensors, and other optoelectronic devices. This innovative PCB solution offers enhanced performance, reliability, and miniaturization capabilities for advanced optical systems.

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Key aspects of the ENIG process for Rigid-Flex PCBs include:

1. Uniform plating across both rigid and flexible areas
2. Excellent solderability and extended shelf life
3. Compatibility with fine-pitch components
4. Enhanced flexibility without compromising electrical performance
5. Superior corrosion resistance for harsh environments

The process involves depositing a layer of electroless nickel (3-6 繕m) followed by a thin layer of immersion gold (0.05-0.1 繕m) on both rigid and flexible substrates. Special care is taken to ensure consistent plating across the transition zones between rigid and flexible areas.

ENIG for Rigid-Flex PCBs excels in applications requiring a combination of high component density and mechanical flexibility, such as smartphones, wearable devices, and advanced medical equipment.

While more complex and costly than traditional finishes, the ENIG process for Rigid-Flex PCBs offers unparalleled durability and performance in compact, flex-rigid designs. It’s particularly valuable in high-reliability applications where space is at a premium and traditional connectors are impractical.

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