Our Multilayer HDI (High Density Interconnect) PCBs represent the cutting edge of printed circuit board technology, designed to meet the demanding requirements of today’s compact, high-performance electronic devices. These sophisticated boards utilize advanced manufacturing techniques to achieve unprecedented circuit density while maintaining superior electrical performance.

Key Features:

Ultra-High Circuit Density – HDI technology enables significantly more connections per unit area compared to traditional PCBs, with via-in-pad capabilities and microvias as small as 0.1mm diameter. This allows for complex routing in minimal space.

Advanced Layer Stack-up – Available in configurations from 4 to 20+ layers, with sequential lamination processes that enable blind and buried vias for optimal signal routing and space utilization.

Superior Signal Integrity – Shorter signal paths and reduced parasitic effects result in improved electrical performance, making these boards ideal for high-frequency applications up to millimeter-wave frequencies.

Miniaturization Excellence – Perfect for space-constrained applications where traditional PCB technology reaches its limits, enabling smaller form factors without compromising functionality.

Enhanced Thermal Management – Strategic via placement and advanced materials help dissipate heat more effectively, crucial for high-power density applications.

Applications:

• Smartphones and tablets
• Wearable electronics
• Medical devices and implants
• Automotive electronics
• Aerospace and defense systems
• IoT devices and sensors
• High-speed computing equipment

Technical Specifications:

• Line width/spacing: Down to 25/25 μm
• Via diameter: 0.1-0.15mm (microvias)
• Layer count: 4-20+ layers
• Board thickness: 0.4-3.2mm
• Impedance control: ±5% tolerance
• Material options: FR-4, Rogers, polyimide, and other advanced substrates

Quality Assurance: All HDI PCBs undergo rigorous testing including electrical testing, microsection analysis, and thermal cycling to ensure reliability in demanding applications. Our manufacturing processes are certified to ISO 9001, IPC Class 3, and automotive standards.

Why Choose Our HDI PCBs: With state-of-the-art manufacturing facilities and experienced engineering support, we deliver HDI solutions that push the boundaries of what’s possible in electronic design. Our expertise in advanced materials and processes ensures your products meet the highest performance standards while optimizing cost-effectiveness.

Transform your next-generation electronic designs with our Multilayer HDI PCB solutions – where innovation meets precision manufacturing.

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Key Features:

Our HDI PCBs utilize microvias, buried vias, and sequential lamination to achieve unprecedented routing density in compact form factors. With trace widths as narrow as 75μm and via sizes down to 100μm, these boards enable complex designs that would be impossible with traditional PCB technology. The multilayer construction supports high-speed signal integrity while maintaining excellent thermal management properties.

Rush Production Capabilities:

Standard delivery times range from 24 hours to 5 business days, depending on complexity and layer count. Our streamlined manufacturing process eliminates typical bottlenecks while maintaining strict quality controls. Each board undergoes comprehensive electrical testing, impedance verification, and visual inspection before shipment.

Technical Specifications:

Available in 4 to 20+ layers with minimum line width/spacing of 3/3 mils. Supports multiple via structures including blind, buried, and stacked microvias. Compatible with advanced materials including low-loss dielectrics for high-frequency applications. Standard thickness tolerance of ±10% with tighter tolerances available upon request.

Applications:

Ideal for smartphones, tablets, wearables, medical devices, aerospace electronics, and any application requiring maximum functionality in minimal space. Perfect for prototyping, pilot production, or urgent replacement boards where time-to-market is critical.

Quality Assurance:

ISO 9001 certified facility with IPC Class 2 and Class 3 capabilities. Full traceability documentation provided with each order. 100% electrical testing and optional X-ray inspection available for mission-critical applications.

Transform your design concepts into reality faster than ever with our Quick Turn HDI PCB solutions.

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Key Features & Capabilities:

Our HDI PCB manufacturing process supports complex multilayer constructions with via-in-pad technology, allowing for extremely tight component spacing and reduced board footprints. We manufacture boards with line widths and spacing as fine as 50μm, microvia diameters down to 100μm, and layer counts exceeding 20 layers while maintaining exceptional signal integrity and thermal management.

Advanced Manufacturing Technologies:

Our state-of-the-art facility employs laser drilling for precise microvia formation, sequential build-up (SBU) processes for complex layer stacking, and advanced plating techniques ensuring reliable interconnections throughout the board structure. We utilize automated optical inspection (AOI) and electrical testing at every critical stage to guarantee consistent quality and reliability.

Applications & Industries:

HDI PCBs are essential for smartphones, tablets, wearable devices, medical implants, aerospace systems, and high-performance computing applications where space constraints and signal integrity are critical. These boards enable the miniaturization trends driving modern electronics while supporting high-speed digital signals, RF applications, and mixed-signal designs.

Quality & Compliance:

All HDI PCBs are manufactured to IPC Class 2 and Class 3 standards with full traceability and comprehensive testing protocols. We maintain ISO 9001, ISO 14001, and IATF 16949 certifications, ensuring consistent quality for automotive, medical, and aerospace applications.

Custom Solutions:

We work closely with design engineers to optimize HDI stackups for specific applications, providing design-for-manufacturing (DFM) guidance and rapid prototyping services to accelerate time-to-market for innovative products requiring advanced PCB technology.

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Board Material：IT-958G

Thickness: 1.3mm

Number of layers：12 layers PCB

Minimum line width/spacing: 2.5/2.5mil

Finished copper thickness: inner layer 1OZ, outer layer 1OZ

Acceptance standard: IPC6012 CLASS 3 level

Surface technology: immersion gold

Dielectric constant: 3.8

Loss Factor: 0.0057

Application: New energy

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