ENIG Surface Finish 4 LAYER BGA PCB Archives - 91做厙 /product-tag/enig-surface-finish-4-layer-bga-pcb/ PCB manufacturer and PCB assembly Sat, 08 Mar 2025 16:18:15 +0000 en-US hourly 1 https://wordpress.org/?v=7.0 /wp-content/uploads/2022/01/cropped-3-1-32x32.jpg ENIG Surface Finish 4 LAYER BGA PCB Archives - 91做厙 /product-tag/enig-surface-finish-4-layer-bga-pcb/ 32 32 222728799 RayMing ENIG Surface Finish 4 LAYER BGA PCB /product/enig-surface-finish-4-layer-bga-pcb/ Fri, 07 Mar 2025 06:42:06 +0000 /?post_type=product&p=41233 Electroless Nickel Immersion Gold (ENIG) surface finish is a popular choice for 4-layer Ball Grid Array (BGA) Printed Circuit Boards (PCBs). This finish provides excellent solderability, uniform surface planarity, and extended shelf life, making it ideal for BGA applications. In a 4-layer BGA PCB, ENIG offers several advantages: Flatness: ENIG provides a consistently flat surface, […]

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]]> Electroless Nickel Immersion Gold (ENIG) surface finish is a popular choice for 4-layer Ball Grid Array (BGA) Printed Circuit Boards (PCBs). This finish provides excellent solderability, uniform surface planarity, and extended shelf life, making it ideal for BGA applications.

In a 4-layer BGA PCB, ENIG offers several advantages:

  1. Flatness: ENIG provides a consistently flat surface, crucial for proper BGA solder ball attachment.
  2. Fine pitch compatibility: Suitable for fine-pitch BGAs due to its thin, uniform coating.
  3. Corrosion resistance: The gold layer protects against oxidation and corrosion.
  4. Extended shelf life: ENIG-finished PCBs can be stored for longer periods without degradation.
  5. Multiple reflow cycles: Withstands multiple heating cycles during assembly.

The ENIG process involves depositing a thin layer of nickel (3-6 繕m) followed by a thinner layer of gold (0.05-0.1 繕m). This combination ensures good solderability while preventing excessive gold embrittlement in solder joints.

For 4-layer BGA PCBs, ENIG’s planarity and reliability make it an excellent choice, especially for high-density, fine-pitch applications in industries like aerospace, telecommunications, and high-performance computing.

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