Our 6-layer PCB fabrication service delivers reliable, high-performance circuit boards designed for medium complexity electronic projects. These boards feature six conductive copper layers separated by insulating substrate materials, providing enhanced routing density and improved signal integrity compared to standard 2 or 4-layer designs.

Key Features:

• Six copper layers for increased routing flexibility and component density
• Controlled impedance options for high-speed digital and RF applications
• Via technology including through-hole, blind, and buried vias for optimal interconnection
• Multiple dielectric options to meet specific electrical requirements
• Precision drilling with standard via sizes from 0.1mm to 6.0mm
• Surface finishes including HASL, ENIG, OSP, and immersion silver
• Solder mask colors in green, red, blue, black, white, and yellow
• Silkscreen printing for component identification and assembly guidance

Specifications:

• Board thickness: 0.4mm to 3.2mm
• Copper weight: 0.5oz to 3oz per layer
• Minimum trace/space: 0.1mm/0.1mm
• Maximum board size: 500mm x 400mm
• Layer stackup customizable based on application requirements

Applications: Ideal for telecommunications equipment, industrial control systems, automotive electronics, medical devices, and consumer electronics requiring enhanced functionality in compact form factors. Perfect for designs with moderate component density, mixed-signal circuits, and applications requiring improved electromagnetic compatibility.

Quality Assurance: All boards undergo comprehensive testing including electrical testing, impedance verification, and visual inspection. Manufactured to IPC-A-600 Class 2/Class 3 standards with full traceability and documentation provided.

Lead Time: 7-12 business days for standard orders, with expedited options available.

Transform your electronic designs with our reliable 6-layer PCB fabrication service, combining precision manufacturing with competitive pricing for your medium complexity projects.

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Our comprehensive 6-layer PCB service delivers aerospace-grade circuit boards specifically engineered for unmanned aerial vehicles. From initial design consultation through manufacturing to complete assembly, we provide end-to-end solutions that meet the rigorous demands of modern UAV applications.

Design Excellence

Our specialized engineering team creates high-density 6-layer PCB designs optimized for flight performance. We incorporate advanced signal integrity analysis, controlled impedance routing, and thermal management techniques specifically for UAV requirements. Each design undergoes comprehensive verification to ensure reliability in aerial operations.

Precision Manufacturing

Using state-of-the-art equipment, we produce 6-layer PCBs with exceptional accuracy and consistency:

• Ultra-fine trace resolution (down to 3mil)
• Specialized lightweight materials with high thermal stability
• FR-4 high-Tg, polyimide, and Rogers material options
• Automated optical inspection at multiple stages
• Strict adherence to IPC Class 3 standards for aviation applications

Expert Assembly

Our precision assembly process ensures your UAV PCBs perform flawlessly:

• Automated SMT placement with 簣0.02mm accuracy
• Advanced BGA/QFN mounting capabilities
• Lead-free soldering with nitrogen atmosphere
• Comprehensive functional testing
• Full environmental stress screening available

Perfect for UAV Applications

• Flight controllers
• Power management systems
• Navigation and guidance systems
• Sensor integration platforms
• Communication modules
• Payload control systems

Contact us today to discuss how our 6-layer UAV PCB solutions can take your aerial technology to new heights.

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This gold finish offers numerous benefits for complex 6-layer designs:

1. Enhanced conductivity and low contact resistance, crucial for high-density, high-frequency applications.
2. Excellent solderability and extended shelf life, ideal for boards requiring long-term storage.
3. Increased corrosion resistance, protecting the underlying copper from oxidation.
4. Flat surface topography, essential for fine-pitch components and advanced packaging techniques.

The 6-layer structure allows for intricate circuit designs, improved signal integrity, and better power distribution, making these boards suitable for sophisticated electronic devices in industries such as telecommunications, aerospace, and high-performance computing. The immersion gold finish further enhances the reliability and performance of these advanced multilayer PCBs, ensuring consistent quality in demanding applications.

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Key features include:

1. High thermal resistance (Tg of 170簞C) for improved reliability in extreme conditions
2. Six conductive layers for complex circuit designs and high component density
3. Gold-plated edge connectors (Goldfinger) for enhanced durability and conductivity
4. Excellent signal integrity and reduced electromagnetic interference
5. Superior thermal management capabilities

TG170 material offers enhanced stability and reduced signal loss at high frequencies, making these PCBs ideal for high-speed digital circuits, RF applications, and aerospace electronics. The Goldfinger edge connectors ensure robust, low-resistance connections in plug-in card applications.

While more expensive than standard PCBs, 6 Layer TG170 Goldfinger boards offer unparalleled performance in demanding environments, making them a go-to choice for mission-critical and high-reliability electronic systems.

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Key features include:

1. Enhanced signal integrity due to multiple ground and power planes
2. Improved EMI/RFI shielding capabilities
3. Reduced crosstalk between signal traces
4. Excellent thermal management properties
5. High durability and long-term reliability

Commonly used in aerospace, medical devices, and high-end computing, 6 Layer Soft Gold PCBs excel in applications requiring complex circuitry, high-speed signal transmission, and stringent quality standards. The soft gold plating ensures multiple reflow cycles without degradation, making these boards perfect for prototyping and testing phases.

While more expensive than simpler alternatives, 6 Layer Soft Gold PCBs offer unparalleled performance and longevity, making them a cost-effective choice for demanding electronic projects.

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1. Layer Structure: Six alternating layers of copper and insulating material, providing enhanced design complexity and signal integrity.

2. ENIG Finish: A surface treatment consisting of an electroless nickel layer (typically 3-6 繕m) covered by a thin immersion gold layer (0.05-0.1 繕m).

3. Design Flexibility: Allows for complex routing and high-density component placement across multiple layers.

4. Signal Integrity: Improved signal transmission and reduced electromagnetic interference due to the multi-layer structure.

5. Surface Characteristics:

   • Excellent flatness for fine-pitch component placement
   • Uniform surface finish across all layers
   • Enhanced corrosion resistance and extended shelf life

6. Applications: Ideal for high-frequency circuits, telecommunications equipment, medical devices, and aerospace technology.

7. Manufacturing Process: Involves precise control of layer alignment, via formation, and ENIG plating to ensure uniform coverage and optimal performance.

8. Performance Benefits:

   • Superior impedance control across all six layers
   • Excellent solderability and wire bonding compatibility
   • Suitable for both leaded and lead-free soldering processes

This configuration balances advanced electrical performance, reliability, and manufacturability, making it suitable for a wide range of demanding electronic applications.

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1. Layer Structure: Six alternating layers of copper and insulating material, providing enhanced design flexibility and signal integrity.

2. Black Solder Mask: A specialized solder mask that gives the PCB its characteristic black appearance, offering improved contrast for visual inspection.

3. Immersion Gold Finish: A thin layer of gold deposited through an immersion process, typically 0.05-0.1 繕m thick.

4. Aesthetic Appeal: The combination of black solder mask and gold finish creates a premium, high-end look suitable for visible applications.

5. Technical Benefits:

   • Excellent planarity for fine-pitch component placement
   • Enhanced corrosion resistance and extended shelf life
   • Uniform surface finish across all six layers

6. Applications: Ideal for high-performance computing, aerospace, medical devices, and luxury consumer electronics.

7. Manufacturing Process: Involves careful control of the black solder mask application and precise immersion gold plating to ensure uniform coverage without affecting the board’s dark appearance.

8. Performance Characteristics:

   • Superior signal integrity in complex, high-density designs
   • Improved heat dissipation properties
   • Excellent solderability and wire bonding compatibility

This configuration combines advanced electrical performance with unique aesthetic properties, making it suitable for both high-reliability applications and visually prominent electronic products.

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1. Layer Structure: Six alternating layers of copper and insulating material, offering increased design complexity and signal integrity.

2. ENIG Plating: Consists of an electroless nickel layer followed by a thin immersion gold coating.

3. Thickness Specifications:

   • Nickel layer: Typically 120-240繕” (3-6 繕m)
   • Gold layer: 2繕” (0.05 繕m), providing optimal protection without excess material

4. Benefits of 2繕” Gold:

   • Sufficient for excellent solderability and wire bonding
   • Prevents gold embrittlement in solder joints
   • Cost-effective compared to thicker gold layers

5. Applications: Ideal for high-frequency circuits, aerospace, medical devices, and telecommunications equipment.

6. Performance Characteristics:

   • Enhanced signal integrity in complex, high-density designs
   • Improved impedance control across all six layers
   • Excellent flatness for fine-pitch component placement

7. Reliability: The precise 2繕” gold thickness ensures long-term protection against oxidation without compromising solderability or introducing potential reliability issues associated with excessive gold content.

This configuration balances advanced performance with cost-effectiveness in demanding electronic applications.

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