Our Any Layer HDI (High Density Interconnect) PCBs represent the pinnacle of advanced circuit board technology, delivering unprecedented miniaturization capabilities for today’s most demanding electronic applications. Engineered with microvias, buried vias, and blind vias throughout multiple layers, these boards enable complex routing in compact form factors that traditional PCBs simply cannot achieve.

Key Features

Advanced Via Technology: Featuring microvias as small as 0.1mm diameter with precise laser drilling, our HDI boards support via-in-pad configurations and stacked microvia structures for maximum routing density.

Multi-Layer Flexibility: Available in configurations from 4 to 20+ layers with any-layer interconnect capability, allowing signal routing between any combination of layers for optimal design freedom.

Superior Signal Integrity: Controlled impedance design with tight tolerances (±5%) ensures excellent high-frequency performance, making these boards ideal for RF applications, high-speed digital circuits, and sensitive analog designs.

Exceptional Miniaturization: Achieve up to 75% size reduction compared to conventional PCBs while maintaining full functionality, perfect for smartphones, wearables, medical devices, and aerospace applications.

Technical Specifications

• Layer Count: 4-20+ layers with sequential build-up
• Minimum Trace Width: 0.075mm (3 mil)
• Minimum Via Size: 0.1mm diameter microvias
• Board Thickness: 0.4mm to 3.2mm
• Aspect Ratio: Up to 12:1 for through holes
• Surface Finish: HASL, ENIG, OSP, or Immersion Silver

Applications

Perfect for cutting-edge electronics including 5G telecommunications equipment, IoT devices, automotive electronics, medical implants, and high-performance computing systems where space constraints and signal integrity are critical.

Manufacturing Excellence: Built using state-of-the-art sequential lamination processes with rigorous quality control at every step. Full electrical testing and AOI inspection ensure 99.5% yield rates and reliable performance in mission-critical applications.

Transform your next project with HDI technology that pushes the boundaries of what’s possible in electronic design.

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Our Multilayer HDI (High Density Interconnect) PCBs represent the cutting edge of printed circuit board technology, designed to meet the demanding requirements of today’s compact, high-performance electronic devices. These sophisticated boards utilize advanced manufacturing techniques to achieve unprecedented circuit density while maintaining superior electrical performance.

Key Features:

Ultra-High Circuit Density – HDI technology enables significantly more connections per unit area compared to traditional PCBs, with via-in-pad capabilities and microvias as small as 0.1mm diameter. This allows for complex routing in minimal space.

Advanced Layer Stack-up – Available in configurations from 4 to 20+ layers, with sequential lamination processes that enable blind and buried vias for optimal signal routing and space utilization.

Superior Signal Integrity – Shorter signal paths and reduced parasitic effects result in improved electrical performance, making these boards ideal for high-frequency applications up to millimeter-wave frequencies.

Miniaturization Excellence – Perfect for space-constrained applications where traditional PCB technology reaches its limits, enabling smaller form factors without compromising functionality.

Enhanced Thermal Management – Strategic via placement and advanced materials help dissipate heat more effectively, crucial for high-power density applications.

Applications:

• Smartphones and tablets
• Wearable electronics
• Medical devices and implants
• Automotive electronics
• Aerospace and defense systems
• IoT devices and sensors
• High-speed computing equipment

Technical Specifications:

• Line width/spacing: Down to 25/25 μm
• Via diameter: 0.1-0.15mm (microvias)
• Layer count: 4-20+ layers
• Board thickness: 0.4-3.2mm
• Impedance control: ±5% tolerance
• Material options: FR-4, Rogers, polyimide, and other advanced substrates

Quality Assurance: All HDI PCBs undergo rigorous testing including electrical testing, microsection analysis, and thermal cycling to ensure reliability in demanding applications. Our manufacturing processes are certified to ISO 9001, IPC Class 3, and automotive standards.

Why Choose Our HDI PCBs: With state-of-the-art manufacturing facilities and experienced engineering support, we deliver HDI solutions that push the boundaries of what’s possible in electronic design. Our expertise in advanced materials and processes ensures your products meet the highest performance standards while optimizing cost-effectiveness.

Transform your next-generation electronic designs with our Multilayer HDI PCB solutions – where innovation meets precision manufacturing.

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Key Features:

Our HDI PCBs utilize microvias, buried vias, and sequential lamination to achieve unprecedented routing density in compact form factors. With trace widths as narrow as 75μm and via sizes down to 100μm, these boards enable complex designs that would be impossible with traditional PCB technology. The multilayer construction supports high-speed signal integrity while maintaining excellent thermal management properties.

Rush Production Capabilities:

Standard delivery times range from 24 hours to 5 business days, depending on complexity and layer count. Our streamlined manufacturing process eliminates typical bottlenecks while maintaining strict quality controls. Each board undergoes comprehensive electrical testing, impedance verification, and visual inspection before shipment.

Technical Specifications:

Available in 4 to 20+ layers with minimum line width/spacing of 3/3 mils. Supports multiple via structures including blind, buried, and stacked microvias. Compatible with advanced materials including low-loss dielectrics for high-frequency applications. Standard thickness tolerance of ±10% with tighter tolerances available upon request.

Applications:

Ideal for smartphones, tablets, wearables, medical devices, aerospace electronics, and any application requiring maximum functionality in minimal space. Perfect for prototyping, pilot production, or urgent replacement boards where time-to-market is critical.

Quality Assurance:

ISO 9001 certified facility with IPC Class 2 and Class 3 capabilities. Full traceability documentation provided with each order. 100% electrical testing and optional X-ray inspection available for mission-critical applications.

Transform your design concepts into reality faster than ever with our Quick Turn HDI PCB solutions.

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Key Features & Capabilities:

Our HDI PCB manufacturing process supports complex multilayer constructions with via-in-pad technology, allowing for extremely tight component spacing and reduced board footprints. We manufacture boards with line widths and spacing as fine as 50μm, microvia diameters down to 100μm, and layer counts exceeding 20 layers while maintaining exceptional signal integrity and thermal management.

Advanced Manufacturing Technologies:

Our state-of-the-art facility employs laser drilling for precise microvia formation, sequential build-up (SBU) processes for complex layer stacking, and advanced plating techniques ensuring reliable interconnections throughout the board structure. We utilize automated optical inspection (AOI) and electrical testing at every critical stage to guarantee consistent quality and reliability.

Applications & Industries:

HDI PCBs are essential for smartphones, tablets, wearable devices, medical implants, aerospace systems, and high-performance computing applications where space constraints and signal integrity are critical. These boards enable the miniaturization trends driving modern electronics while supporting high-speed digital signals, RF applications, and mixed-signal designs.

Quality & Compliance:

All HDI PCBs are manufactured to IPC Class 2 and Class 3 standards with full traceability and comprehensive testing protocols. We maintain ISO 9001, ISO 14001, and IATF 16949 certifications, ensuring consistent quality for automotive, medical, and aerospace applications.

Custom Solutions:

We work closely with design engineers to optimize HDI stackups for specific applications, providing design-for-manufacturing (DFM) guidance and rapid prototyping services to accelerate time-to-market for innovative products requiring advanced PCB technology.

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Layers: 6 layers 

Special Process: HDI PCB

Minimum line width: 0.075mm Minimum line spacing: 0.075mm

Surface treatment: Immersion gold

tolerance: +0.05/-0.15mm (no locating holes in the plate)

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This type of PCB design requires advanced knowledge of high-frequency circuit design, electromagnetic theory, and PCB manufacturing processes. It’s often used in applications such as automotive radar, 5G communication systems, and industrial sensing.

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1. Structure:

   • 6 conductive layers
   • Multiple lamination cycles
   • Microvias (typically less than 150 microns in diameter)

2. Microvia types:

   • Blind vias (connecting an outer layer to an inner layer)
   • Buried vias (connecting inner layers)
   • Stacked vias (microvias stacked on top of each other)

3. Benefits:

   • Increased functionality in a smaller form factor
   • Improved electrical performance
   • Better signal integrity
   • Reduced electromagnetic interference

4. Common applications:

   • Smartphones and tablets
   • Wearable devices
   • Aerospace and defense equipment
   • High-performance computing

5. Manufacturing challenges:

   • Requires advanced manufacturing capabilities
   • More complex design rules
   • Higher cost compared to standard PCBs

Regarding manufacturing in Hungary:

Hungary has a strong electronics manufacturing sector, particularly around Budapest and other major cities. The country has been attracting significant investment in high-tech manufacturing, including PCB production.

Some points to consider for HDI PCB manufacturing in Hungary:

1. Advanced capabilities: Ensure the manufacturer has experience with HDI and microvia technology.
2. Equipment: Check if they have the necessary advanced equipment for laser drilling and lamination.
3. Quality control: Look for certifications like ISO 9001, ISO 14001, and potentially industry-specific certifications.
4. Design support: Some manufacturers offer design assistance, which can be crucial for complex HDI layouts.
5. Prototyping services: For complex designs, the ability to produce prototypes quickly can be valuable.

To help visualize the structure of a 6-layer HDI PCB with microvias, I can create a simple diagram for you.

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Plate thickness: 1.0mm

Minimum hole diameter: 0.1mm

Minimum line width/spacing: 0.075mm/0.075mm

Inner layer copper thickness: 35μm

Outer layer copper thickness: 35μm

Surface treatment: gold plating + gold finger + beveling ENIG + OSP + Beveling of G/F

Minimum distance from hole to wire: 0.16mm

What is 10 Layer 3 Step HDI Gold Finger PCB ?

The 10-layer, three-step HDI gold finger board is a high-performance, high-reliability special type of PCB board. It consists of 10 layers of conductive circuit boards laminated together, and the circuits of each layer are connected through metallized holes for electrical interconnection. At the same time, it has multiple metal connection points, which are usually gold-plated to improve conductivity and corrosion resistance. These metal connection points can be used to make connections to other circuit boards or devices.

The 10-layer, three-step gold finger board is a high-performance, high-reliability special type of PCB board for the manufacture of high-end electronic devices and systems.

As a high-performance, high-reliability special type of PCB board, 10-layer third-order gold finger board has a wide range of application scenarios. The following are some common application scenarios:

Servers and data centers: in servers and data centers, a large number of electronic components need to be connected together to form a highly efficient circuit network. 10-layer triple-order gold finger boards can provide better electrical performance and signal transmission effects to ensure the stability and reliability of the equipment.

Communication equipment: communication equipment requires high-speed and efficient signal transmission, 10-layer third-order gold fingerprint board can provide better signal transmission and more stable electrical performance to ensure the normal operation of the equipment.

Industrial control and automation equipment: in industrial control and automation equipment, a large number of sensors, controllers and actuators need to be connected together to form a highly efficient control system. 10-layer triple-order gold fingerprint boards can provide better electrical performance and signal transmission to ensure the stability and reliability of the equipment.

Medical Equipment: Medical equipment requires highly reliable and stable circuitry to ensure the accuracy and safety of the equipment. 10-layer triple-order gold fingerprint boards can provide better electrical performance and signal transmission to ensure the stability and reliability of the equipment.

As a high-performance, high-reliability special type of PCB board, 10-layer third-order gold finger board has a wide range of application prospects in many fields.

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